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HP ThinPro 8.0 Service Pack 6 Released

HP has released a new service pack for the ThinPro 8 platform.

PLATFORM:

  • ThinPro 8

SP6 (v6.2)

ThinPro 8.0 (T8X80029) Image Known Issues:
============================================================================
ThinPro 8.0 image has a timing issue causing Service Pack Upgrades to intermittently fail. This has been corrected in the ThinPro 8.0 Service Pack 1 Recovery image, Service Pack 1 Upgrade and subsequent Service Packs.

Security Updates:

  • Linux kernel vulnerability – CVE-2023-0459,CVE-2023-1075,CVE-2023-1078,CVE-2023-1118,CVE-2023-1513,CVE-2023-1829,CVE-2023-1872,CVE-2023-2162,CVE-2022-3707,CVE-2023-20938,CVE-2022-27672,CVE-2023-32269
  • ncurses vulnerabilities – CVE-2019-17594,CVE-2019-17595,CVE-2021-39537,CVE-2022-29458,CVE-2023-29491
  • ca-certificates update

Release Notes:

https://ftp.hp.com/pub/tcdebian/updates/8.0.0/service_packs/ThinPro8.0_SP-6.2-signed.txt

Download the service pack through HP Thin Update or by using HP Update Center from HP Device Manager

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HP ThinPro 8.0 Service Pack 6 Released